Die Attach/Wire Bond Development Technician
Micron
Muar, 01, MY
1 hari yang lalu

Req. ID : 138711

Recruiter : Sarina Binti Madarasa

RESPONSIBILITIES :

  • Responsible for assists engineer in process development of die attached / wire bond process.
  • Setup die attach / wire bond assembly machine and prepare materials for NPI builds (engineering sample / qual sample)
  • Assist engineer for characterizing new recipe for die attach / devoid / strip plasma / strip ID mark / wire bond
  • Monitor performance, quality and reliability of assembly processes.
  • Identify problems or unfavorable deviations and recommend corrective and improvement actions.
  • Assist engineer for new equipment benchmark, optimization, capability roadmaps and tooling equipment.
  • Support new package development, ramp ups and platform extensions.
  • Support process roadmap updates for newly developed package technology.
  • Able to work in shift pattern
  • REQUIREMENTS :

  • Diploma in Electrical & Eletronics Engineering, Material Engineering, Material Engineering or similar subject.
  • Candidate must possess minimum 3 years in semiconductor industry in the field of package development or assembly engineering.
  • Experienced in die attach / plasma / wire bond process in IC assembly industry.
  • Good knowledge of data analysis / machine hands on
  • Knowledgeable in IC Packaging Assembly Process Flow.
  • Independent with good communication and co-ordination skills.
  • Great team work within the team and cross functional team
  • We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.

    This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

    Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy.

    The administrator will monitor compliance and is available to answer any questions on EEO matters.

  • To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918

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    or 208-368-4748

    Keywords : Muar Johor (MY-01) Malaysia (MY) Backend Manufacturing Experienced Regular Engineering #LI-LT1 Tier 2

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