Microchip Technology Inc. is a leading provider of embedded control applications. Our product portfolio comprises general purpose and specialized 8-bit, 16-bit, and 32-bit microcontrollers, 32-bit microprocessors, field-programmable gate array (FPGA) products, a broad spectrum of high-performance linear, mixed-signal, power management, thermal management, radio frequency (RF), timing, safety, security, wired connectivity and wireless connectivity devices, as well as serial Electrically Erasable Programmable Read Only Memory (EEPROM), Serial Flash memories, Parallel Flash memories, and serial Static Random Access Memory (SRAM).
We also license Flash-IP solutions that are incorporated in a broad range of products.
To assist the QA Manager and Subcontractor Quality Engineering team to manage subcontractors’ quality and packing / labeling.
This person is to be stationed in Penang.
Manage and review periodically subcontractors’ scorecard and follow up on improvements.
Coordinate packing and labeling change / activities in subcons
Perform audit at subcontractors’ site and follow up until closure of all audits corrective action.
Drive subcontractors’ improvement program.
Drive and coach subcontractor on permanent solution for customer returns related to assembly test, and Shipping Distribution (when necessary).
Responsible for timely closure of all 8Ds and corrective actions.
Establish Best Known Method or Good Manufacturing Practices across all subcontractors.
Manage and dispose all on hold lots at subcontractor.
Participate in Microchip’s NPI activities, either in assembly or test.
QA personnel from other Microchip sites.
PE, CQE, CQM and relevant staffs from other Microchip sites.
All Microchip Subcontractors.
Raw material suppliers (when necessary)
A Master / Degree in Science (Physics / Chemistry / Statistics / Material) or Engineering (Mech / Elect / Electronics / Chemical) or a degree in any discipline plus 2 years or more experience in QA department managing subcontractors.
Good understanding on QC tools & automotive core tools / Quality System based on ISO / TS.
Good ability to solve problems based on known problem solving methodology.
Good command of English language.
Good process knowledge about IC Assembling and Testing (FOL / EOL / Testing).
Good understanding on Jedec / IPC and Mil Std requirements for SMD packages.
Good coordination, monitoring and follow up skills on issues and projects.
Ability to travel when required
Train subcon on packing and labeling requirements
Resolve subcon’s packing and labeling issues
Packing specs consolidation / alignment