Process Engineer (Wire Bond-Wedge Bond)
Infineon Technologies
Melaka ,Malaysia
5 hari yang lepas

In your new role you will :

  • Develop and realize process stability and improvement. Drive for %LRR reduction for GTR, SCAR and Cap Test
  • Support process in line systems on mass volume production environment
  • Actively support, participate and embrace an empowered team culture including significant interaction with manufacturing, quality and engineering groups.
  • Accountable for process quality on equipment / process level
  • Continuous Improvement on Quality and Yield in respective process, NLoZD and NLoP Projects
  • Daily monitoring on process performance. Fast reaction and accurate disposition in deviation management (DDM)
  • Profile

    You are best equipped for this task if you have :

  • Bachelor Degree holder
  • Min. 3 years working experience in wirebond process or maintenance in manufacturing environment
  • Knowledge and experience in Shinkawa wire bond platform will be an added advantage
  • Possess good analytical skills and innovative in problem solving
  • Ability to work in a team in problem solving and improvement. Capable to contribute as a supporting team as well as a leader in an improvement project
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