Senior/Die Attach Equipment Engineer
HPS Partners Pte Ltd
Malaysia
5 hari yang lepas

Job Description

  • Ensure robustness of process control to meet yield and thru-put expectation
  • New Material first articles inspection and final buyoff
  • Documentation of SOP, WI, FMEA, OCAP, and Control Plan for related process
  • Ensure effective hand shaking process of new device / product introduction to the line and new process technology capabilities developments
  • Continuous improvement on direct / indirect materials cost down & yield enhancement program
  • Report any non-conformance issue and come out with an improvement actions
  • Job Requirements

  • Bachelor / Master / PhD in Mechanical / Material / Electrical / Physics or relevant engineering with min. 3 years of experience in semiconductor assembly and test manufacturing plant.
  • Familiar with Substrate Baking, Plasma Cleaning, Normal Cure, High Pressure cure & Die Attach
  • Familiar with die attach materials such as DAF, FOD, FOW
  • Experience in high die stack up to 8 - 32 Dies
  • Proficient in AutoCAD, JMP, SPC, DOE, DMAIC, 8D, 5-why
  • Memohon
    Memohon
    E-mel saya
    Dengan mengklik 'Teruskan', saya bersetuju dengan Privasi Lihat di sini
    Seterusnya
    Borang permohonan