R&D Process Developer (Junior)
Electrical / Electronics Industry
Malaysia, Malaysia
4 hari yang lepas

Description Job DescriptionCompany Profile : One of the world's largest providers of outsourced semiconductor packaging and test services.

Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs.

Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services.

More than 40 years of power discrete experience, features 260k sq.

of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe.

In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location : Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities : - Semiconductor discrete package design and development - Characterize and qualify new material (e.

g. : solder paste, mold compound, etc) for power discrete packages - Characterize and qualify new process technologies for power discrete product manufacturing.

  • Project management for process and material development - Process / material development based on APQP - Process and material development documentation Required Qualifications Requirements : -
  • Well-versed in English - Graduated in Master of Bachelor Degree in Electronics / Mechanical / Mechatronics Engineering, Physics, Material Science or similar experiences -

    Experience : 1) Minimal 2-years working experience in semiconductor, R&D experience. - Require Skill : 1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.

    2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN 3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-

    clip bonding, IR reflow, plasma cleaning. 4) Hands-on knowledge and experience in project management for research and development projects 5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage 6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.

    7) Good written and verbal communication skills 8) Able to present ideas, design concepts, data and plan with high confidence.

    9) Able to perform work independently as well as in team. - Age : 26 - 40 Country Malaysia Company Electrical / Electronics Industry Salary Up to US$10,000 Working Hours Full-

    Time Contract Permanent Categories Electrical / Electronics / Instrumentation / Control Industries

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